Olympus LEXT OLS3000 - Confocal Laser Scanning Microscope

Olympus Industrial America has launched LEXT, a new Confocal Laser Scanning Microscope designed for sub-micron imaging, with outstanding 0.12um resolution and accurate three-dimensional measurement capability. Magnification power from 120x to 14,400x satisfies the needs of researchers working between the limits of conventional optical microscopes and scanning electron microscopes (SEMs).

LEXT combines a 408nm laser with optics specifically designed for operation at this wavelength to optimize image quality and limit aberrations. Olympus software provides a simple user interface, fast processing and advanced analysis in a single solution.

Brightfield, Darkfield and Differential Interference Contrast (DIC) Microscopy techniques are possible in both video and laser confocal imaging modes. The new confocal laser DIC mode is especially useful for highlighting subtle textural variations during surface analysis.

Features & Benefits

1. Outstanding resolving power

The 408nm laser diode is combined with optics specifically designed for operation at this wavelength to optimise image quality and limit aberrations. The resolving power is enhanced by confocal optics featuring an additional, optimised circular pinhole and a high speed XY scanner developed from Olympus MEMS technology. The result is world-leading plane resolution which clearly resolves patterns of 0.12µm line-width.
Also, the LEXT does not require any sample preparation such as the dicing, cleaving, deposition. Therefore, the LEXT provide the efficient operation superior than the Scanning Electronic Microscopes (SEMs).

2. Simultaneous 3D and "true color" image acquisition

A unique feature of LEXT is its ability to image samples in 3D and "true color" by combination of the laser image with the full color brightfield image in the system computer. Additional utilization of DIC allows for identification of minute level differences on the surface of a specimen. The range of contrast methods is completed by darkfield for detection of scratches and cracks.

3. High precision 3D measurement

• 2D measurement: Best suited for measurement of 1.5mm to 1µm widths. Both line-width and geometric measurements (e.g. diameter of a circle) are possible.
• 3D measurement: Best suited for measurement of 1mm to 0.5µm bumps. A volume, capacity, surface area, etc. can be measured in 3D. The thickness of a thin transparent film can be measured.
• Roughness analysis: Best suited for the analysis of roughness of about Rz 0.1µm. Analysis of line and surface roughness is possible. Noncontact probing leaves specimen free of scratches.

Accessories

1. Conventional optical microscope capabilities

Like optical microscopes, operating LEXT requires no special knowledge - the image is visible as soon as the specimen is in place, allowing anyone to perform observation and measurement quickly and easily. Familiar optical microscope capabilities such as brightfield, darkfield and Nomarski DIC observation are provided, so even the slightest damage or defect can be detected instantly.

(Brightfield)	(Darkfield)	(Nomarski DIC)

2. Motorized stage (OLS30-CS150AS) --- for fast, accurate throughput

Tiling function enable wider image acquisition area and measurement

The tiling function allows multiple images to be brought together in a single composite image, enlarging the total observation area to a maximum of 12.8X12.8mm, and enabling quick accurate image measurement. Image capturing procedures are set out in recipe form, making work faster and more efficient.

Continuous acquisition	Tiled image	3D image

Continuous measurements of multiple points

Continuous, automatic capture of registered positions on the sample is possible under the same conditions to be taken and recorded automatically.