Olympus LEXT OLS3100IR - Confocal Laser Scanning Microscope

Olympus America is proud to offer the LEXT-IR, a Confocal Laser Scanning Microscope designed for sub-micron imaging and measurement of features beneath silicon. Outstanding 0.55um resolution, accurate three-dimensional measurement capability and magnification power from 120x to 12,960x to satisfy the needs of today’s semiconductor professionals.

Features & Benefits

The LEXT OLS3000IR is our near-IR laser based confocal microscope for nondestructive interior observation of silicon wafers, IC chips, MEMS, Solar and other devices. Packaging technology of semiconductor devices is rapidly advancing along with the increase in the need for thinner and smaller electronics devices. Using an infrared microscope, the LEXT OLS3000IR enables features that cannot be seen visually -- such as SIP (System in Package), 3-dimensional mounting, and CSP (Chip Scale Package) -- to be inspected, measured and analyzed nondestructively.

Ultra-fine subsurface resolution and clarity like a SEM. Fast, efficient and easy-to-use like an optical microscope. Our LEXT OLS3000IR is the best of both worlds.

This new laser scanning confocal technology is designed for applications requiring ultra-precise measurement and observation. The new technology, introduced in the OLS3000IR LEXT micro-imaging system, features sub-micron imaging with outstanding resolution and accurate three-dimensional measurement capability.

The LEXT-IR provides:

• Both 3D observation and measurement in real time
• Resolution of 0.55um line and space patterns.
• Z accuracy measurement of 3 =0.10+0.002L
• Magnification from 120x to 12,960x, ideal for the continued reduction in feature sizes
• No expensive and destructive sample preparation -- just place sample directly on stage with no vacuum pump-down
• Fast measurement and observation tasks in high volume manufacturing applications

This new laser scanning confocal technology is designed for applications requiring ultra-precise measurement and observation. The new technology, introduced in the OLS3000IR LEXT micro-imaging system, features sub-micron imaging with outstanding resolution and accurate three-dimensional measurement capability.